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d a t a sh eet product speci?cation supersedes data of 2002 jan 14 2003 oct 10 integrated circuits saa6581 rds/rbds demodulator
2003 oct 10 2 philips semiconductors product speci?cation rds/rbds demodulator saa6581 features integrated switched capacitor filter demodulates european radio data system (rds) or the usa radio broadcast data system (rbds) signals oscillator frequencies: 4.332 or 8.664 mhz integrated ari clamping cmos device single supply voltage: 5 v extended temperature range: - 40 to +85 c low number of external components. general description the rds/rbds demodulator is a cmos device with integrated filtering and demodulating of rds/rbds signals coming from a multiplexed input data stream. data signal rdda and clock signal rdcl are provided as outputs for further processing by a suitable microcomputer, for example ccr921 and ccr922. the saa6581t replaces saa6579 in function and pin-compatibility. applications the rds/rbds system offers a large range of applications from the many functions that can be implemented. for car radios the most important are: program service (ps) name traffic program (tp) identification traffic announcement (ta) signal alternative frequency (af) list program identification (pi) enhanced other networks (eon) information. quick reference data ordering information symbol parameter min. typ. max. unit v dda analog supply voltage 4.0 5.0 5.5 v v ddd digital supply voltage 4.0 5.0 5.5 v i dd(tot) total supply current - 6.0 - ma v i(mpx) rds input sensitivity at pin mpx 1 -- mv f i(xtal) crystal input frequency - 4.332 - mhz - 8.664 - mhz type number package name description version saa6581t so16 plastic small outline package; 16 leads; body width 7.5 mm sot162-1 saa6581hn hvqfn32 plastic thermal enhanced very thin quad ?at package; no leads; 32 terminals; body 5 5 0.85 mm sot617-1
2003 oct 10 3 philips semiconductors product speci?cation rds/rbds demodulator saa6581 block diagram handbook, full pagewidth 57 khz 8th order bandpass filter clocked comparator rds/rbds demodulator signal quality detector power supply and reset test control oscillator and clock mpx multiplex input c1 c6 330 pf 560 pf 4 (12) v dda v ssa v ref + 5 v + 5 v c2 100 nf c4 47 pf c5 56 pf c7 100 nf c3 2.2 m f 5 (13) 6 (16) v ssd 11 (27) 3 (9) tcon cin scout 15 (2) 8 (20) 7 (18) mode v ddd 9 (21) osci q1 osco qual rdda rdcl sync 13 (29) 14 (32) 12 (28) (4) 16 (23) 10 (6) 2 (5) 1 mhc651 saa6581 fig.1 block diagram. pin numbers for the saa6581hn are given in parenthesis.
2003 oct 10 4 philips semiconductors product speci?cation rds/rbds demodulator saa6581 pinning symbol pin description so16 hvqfn32 qual 1 5 signal quality indication output rdda 2 6 rds data output n.c. - 7 not connected n.c. - 8 not connected v ref 3 9 reference voltage output ( 1 / 2 v dda ) n.c. - 10 not connected n.c. - 11 not connected mpx 4 12 multiplex signal input v dda 5 13 analog supply voltage (5 v) n.c. - 14 not connected n.c. - 15 not connected v ssa 6 16 analog ground (0 v) n.c. - 17 not connected cin 7 18 comparator input n.c. - 19 not connected scout 8 20 switched capacitor ?lter output mode 9 21 oscillator frequency select input n.c. - 22 not connected sync 10 23 ari clamping control input n.c. - 24 not connected n.c. - 25 not connected n.c. - 26 not connected v ssd 11 27 digital ground (0 v) v ddd 12 28 digital supply voltage (5 v) osci 13 29 oscillator input n.c. - 30 not connected n.c. - 31 not connected osco 14 32 oscillator output n.c. - 1 not connected tcon 15 2 test control input n.c. - 3 not connected rdcl 16 4 rds clock output symbol pin description so16 hvqfn32 handbook, halfpage mhb900 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 qual rdda v ref mpx v dda v ssa cin scout rdcl tcon osco osci v ddd v ssd sync mode saa6581t fig.2 pin configuration for so16. handbook, halfpage v ref v dda n.c. mpx n.c. n.c. v ssa n.c. osco v ddd n.c. osci n.c. v ssd n.c. n.c. saa6581hn n.c. rdda n.c. qual rdcl n.c. tcon n.c. mhc652 cin n.c. scout n.c. mode n.c. sync n.c. 2 1 3 4 5 6 7 16 14 12 15 13 11 10 9 25 28 26 27 29 30 31 32 8 24 23 21 22 20 19 18 17 fig.3 pin configuration for hvqfn32. bottom view.
2003 oct 10 5 philips semiconductors product speci?cation rds/rbds demodulator saa6581 functional description rds/rbds signal demodulation b andpass filter the bandpass filter has a centre frequency of 57 khz. it selects the rds/rbds sub-band from the multiplex signal mpx and suppresses the audio signal components. the filter block contains an analog anti-aliasing filter at the input followed by an 8th order switched capacitor bandpass filter and a reconstruction filter at the output. c locked comparator the comparator digitizes the output signal from the 57 khz bandpass filter for further processing by the digital rds/rbds demodulator. to attain high sensitivity and to avoid phase distortion, the comparator input stage has automatic offset compensation. d emodulator the demodulator provides all functions of the saa6579 and improves performance under weak signal conditions. demodulator functions include: 57 khz carrier regeneration from the two sidebands (costas loop) symbol integration over one rds clock period bi-phase symbol decoding differential decoding synchronization of rds/rbds output data. the rds/rbds demodulator recovers and regenerates the continuously transmitted rds/rbds data stream in the mpx signal and provides clock rdcl for the output signals and data output rdda for further processing by an rds/rbds decoder, for example ccr921 or ccr922. ari clamp the demodulator checks the input signal for presence of rds only, or rds plus ari transmissions. after a fixed test period, if the sync input is set high the demodulator locks in the verified condition (see table 1). if sync is set low, the ari clamping is reset (disabled). after sync returns to high, the demodulator resumes checking the input signal. table 1 control pin sync s ignal quality detection output qual indicates the safety of the regenerated rds data (high = good data; low = unsafe data). oscillator and system clock generator for good performance of the bandpass and demodulator stages, the demodulator requires a crystal oscillator with a frequency of 4.332 or 8.664 mhz. the demodulator can operate with either frequency (see table 2), so that a radio set with a microcontroller can run, in this case, with one crystal only. the demodulator oscillator can drive the microcontroller, or vice versa. table 2 control pins tcon and mode the clock generator generates the internal 4.332 mhz system clock and timing signal derivatives. power supply and internal reset the demodulator has separate power supply inputs for the digital and analog parts of the device. for the analog functions an additional reference voltage ( 1 2 v dda ) is internally generated and available via the output pin v ref . the demodulator requires a defined reset condition. the demodulator generates automatically a reset signal after the power supply v dda is switched on, or at a voltage-drop. sync ari clamping low internal ari clamping disabled high ari clamping allowed to be logged tcon mode oscillator frequency high low 4.332 mhz high high 8.664 mhz
2003 oct 10 6 philips semiconductors product speci?cation rds/rbds demodulator saa6581 limiting values in accordance with the absolute maximum rating system (iec 60134). notes 1. without latching in the entire temperature range. 2. human body model (equivalent to discharging a 100 pf capacitor through a 1.5 k w series resistor). 3. machine model (equivalent to discharging a 200 pf capacitor through a 0 w series resistor and 0.75 m h inductance). thermal characteristics symbol parameter conditions min. max. unit v dd supply voltage 0 6.5 v v n voltage at pins qual, rdda, v ref , mpx, cin, scout, mode, sync, osci, osco, tcon and rdcl with respect to pins v ssa and v ssd pins v dda and v ddd are connected to v dd - 0.5 v dd + 0.5 6.5 v v i(mpx)(p-p) input voltage at pin mpx (peak-to-peak value) note 1 - 6v i i input current at pins qual, rdda, v ref , mpx, v dda , cin, scout, mode, sync, v ddd , osci, osco, tcon and rdcl pins v ssa and v ssd are connected to ground - 10 +10 ma i lu(prot) latch-up protection current in pulsed mode t amb = - 40 to +85 c with voltage limiting - 2 to +10 v - 100 +100 ma t amb =25 c with voltage limiting - 2 to +12 v - 200 +200 ma t amb = - 40 to +85 c without voltage limiting - 10 +10 ma t amb ambient temperature - 40 +85 c t stg storage temperature - 65 +150 c v es electrostatic handling voltage note 2 - 3000 +3000 v note 3 - 400 +400 v symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air saa6581t (so16) 104 k/w saa6581hn (hvqfn32) with soldered heatsink 100 k/w
2003 oct 10 7 philips semiconductors product speci?cation rds/rbds demodulator saa6581 characteristics: digital part v dda =v ddd =5v; t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supply v ddd digital supply voltage 4.0 5.0 5.5 v i ddd digital supply current - 1.5 - ma p tot total power dissipation - 30 - mw inputs v il low-level input voltage at pins tcon, osci, sync and mode -- 0.3v ddd v v ih high-level input voltage at pins tcon, osci, sync and mode 0.7v ddd -- v i i(pu) input pull-up current at pins tcon and mode v ih = 3.5 v - 10 - 20 -m a outputs v ol low-level output voltage at pins qual, rdda and rdcl i ol =2ma -- 0.4 v v oh high-level output voltage at pins qual, rdda and rdcl i oh = - 0.02 ma 4.0 -- v crystal parameters f i(xtal) crystal input frequency tcon = high; mode = low - 4.332 - mhz tcon = high; mode = high - 8.664 - mhz ?d f osc ? adjustment tolerance of oscillator frequency -- 30 10 - 6 ?d f osc(t) ? temperature drift of oscillator frequency t amb = - 40 to +85 c -- 30 10 - 6 c l load capacitance - 30 - pf r xtal crystal resonance resistance -- 120 w
2003 oct 10 8 philips semiconductors product speci?cation rds/rbds demodulator saa6581 characteristics: analog part v dda =v ddd =5v; t amb =25 c; measurements taken in fig.1; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supply v dda analog supply voltage 4.0 5.0 5.5 v ? v dda - v ddd ? difference between analog and digital supply voltages - 0 0.5 v i dd(tot) total supply current - 6.0 - ma v ref reference voltage v dda = 5 v 2.25 2.5 2.75 v z o(vref) output impedance at pin v ref - 25 - k w mpx input (signal before the capacitor on pin mpx) v i(mpx)(rms) rds amplitude (rms value) d f= 1.2 khz rds-signal; d f= 3.2 khz ari-signal 1 -- mv v i(max)(p-p) maximum input signal capability (peak-to-peak value) f=57 2 khz 200 -- mv f < 50 khz 1.4 -- v f < 15 khz 2.8 -- v f > 70 khz 3.5 -- v r i(mpx) input resistance f = 0 to 100 khz 40 -- k w 57 khz bandpass ?lter f c centre frequency t amb = - 40 to +85 c 56.5 57.0 57.5 khz b - 3db - 3 db bandwidth 2.5 3.0 3.5 khz g scout-mpx signal gain f = 57 khz 17 20 23 db a sb stop band attenuation d f= 7 khz 31 -- db f < 45 khz 40 -- db f < 20 khz 50 -- db f > 70 khz 40 -- db r o(scout) output resistance at pin scout f = 57 khz - 30 60 w comparator input (pin cin) v i(min)(rms) minimum input level (rms value) f = 57 khz - 110mv r i input resistance 70 110 150 k w
2003 oct 10 9 philips semiconductors product speci?cation rds/rbds demodulator saa6581 timing data handbook, full pagewidth t clkh t clk t bit(slipped) t d(clk) mhb901 rdda rdcl t d(clk) fig.4 rds timing diagram including a phase change. table 3 rds timing (see fig.4) symbol parameter typ. unit t d(clk) clock-data delay 4 m s t clk clock period 842 m s t clkh clock high time 421 m s t bit(slipped) slipped data bit period 1263 m s
2003 oct 10 10 philips semiconductors product speci?cation rds/rbds demodulator saa6581 package outlines unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot162-1 8 16 w m b p d detail x z e 9 1 y 0.25 075e03 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a 0 5 10 mm scale so16: plastic small outline package; 16 leads; body width 7.5 mm sot162-1 99-12-27 03-02-19
2003 oct 10 11 philips semiconductors product speci?cation rds/rbds demodulator saa6581 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 5.1 4.9 d h 3.25 2.95 y 1 5.1 4.9 3.25 2.95 e 1 3.5 e 2 3.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot617-1 mo-220 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot617-1 hvqfn32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 916 32 25 24 17 8 1 x d e c b a e 2 terminal 1 index area terminal 1 index area 01-08-08 02-10-18 1/2 e 1/2 e a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1)
2003 oct 10 12 philips semiconductors product speci?cation rds/rbds demodulator saa6581 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. through-hole mount packages s oldering by dipping or by solder wave typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: below 220 c (snpb process) or below 245 c (pb-free process) C for all the bga and ssop-t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. below 235 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe
2003 oct 10 13 philips semiconductors product speci?cation rds/rbds demodulator saa6581 dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. these transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the reflow oven. the package body peak temperature must be kept as low as possible. 5. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 6. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 7. wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 8. wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 9. hot bar soldering or manual soldering is suitable for pmfp packages. mounting package (1) soldering method wave reflow (2) dipping through-hole mount dbs, dip, hdip, rdbs, sdip, sil suitable (3) - suitable through-hole- surface mount pmfp (9) not suitable not suitable - surface mount bga, lbga, lfbga, sqfp, ssop-t (4) , tfbga, vfbga not suitable suitable - dhvqfn, hbcc, hbga, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, hvson, sms not suitable (5) suitable - plcc (6) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (6)(7) suitable - ssop, tssop, vso, vssop not recommended (8) suitable -
2003 oct 10 14 philips semiconductors product speci?cation rds/rbds demodulator saa6581 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? koninklijke philips electronics n.v. 2003 sca75 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands r32/03/pp 15 date of release: 2003 oct 10 document order number: 9397 750 12035

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